ABLEBOND 84-3 是一种单组份、不含溶剂的环氧类芯片粘接胶，是Ablebond 84-1LMIT 的绝缘版。本粘接剂可满足Method 5011的要求.

Ablebond 84-3 粘接胶是一种柔软、圆滑的糊状物，适合于自动点胶、丝印或者手工点胶。

Ablebond 84-3广泛应用在各种的微电子、电子的封装.

Viscosity at 25°C:
50,000 cps

Work Life at 25°C:
2 weeks

Cure Condition:
1 hour at 150°C

Cure Option:
2 hours at 125°C

Die Shear Strength (80 mil2 IC Au to Au at 25°C)
6800 psi

Volume Resistivity:
3.5 x 1015 ohm-cm

Glass Transition Temperature (Tg):
85°C

Coefficient of Thermal Expansion


Below Tg:
40 x 10-6 in/in/°C

Above Tg:
10 x 10-5 in/in/°C

Thermal Conductivity at 121°C:
0.48 BTU ft-1hr-1°F-1

Storage Life at -40°C:
1 year
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